Micro Cut Pad V2 - Special Sponge for Removing Fine Scratches, Holograms, and Polishing Marks; High Stability;

Key features

• High-quality foam sponge for removing fine scratches, holograms, and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. Makes for the perfect polishing pad.
• The short 23mm height creates low torsion forces, very good handling, and the highest level of stability; and the dense foam material enables long-lasting compression hardness during polishing. Our buffing pads get the job done right.
• The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.
• The milling edge ensures extra flexibility for the pads, enabling them to fit around contours more easily.
• EXCELLENCE FOR EXPERTS -Since 1968, Koch‑Chemie stands for high-quality cleaning and care products in the fields of washing chemistry, vehicle preparation, workshops, and industry.

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